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Technological
complex of laser processing of materials
The
materials processed: Any types of glass,
including quartz glass Any type of
ceramics. Any type of
steel. Cytalls Silicon Silicon
carbide. Main technical characteristics The
control of the installation is carried out by programmable systems (for
example, SIEMENS SINUMERIC 802S) YAG - laser, functioning in a pulse mode Wavelength of
the radiation, micron - 1,064 Energy in a
pulse, J - 1 - 30 Pulse
duration, nc - 50- 800 Pulse
repetition rate, Hz - 1 - 300 ÑÎ2 –laser (ILGN-802), functioning in a continuous
mode Wavelength of
the radiation, micron - 10,6 Average power
of the radiation, W - 75 Coordinate system Maximal moving
on axes x, y, mm - 500 Maximal speed
of the moving, mm / sec - 150 Accuracy of
positioning, mm - 0, 05 The size of
processed samples, mm - 500-500 Technologies for materials processing: Laser marking
and engraving, Laser welding
and soldering, Laser cutting, Controlled
laser thermo-cutting of fragile non-metal materials, Two-beam
laser processing of fragile non-metal materials, with simultaneous use of
laser sources with different wave lengths, giving selective absorption by
separate layers of the sample; Laser
welding of silicon products. |
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Scientific-research laboratory “Laser technologies of processing materials”
The head, developer – Myshkovets Victor
Tel.(+375 232) 60 07 13, fax (+375 232) 60 30 02
Email: myshkovets@gsu.by